Skip to content
Agentmart
Submit a tool

pcb-thermal-analysis

Guidelines and calculations for high-current copper trace power loss and regulator thermal dissipation.

Skill by medboughrara

IndexedMIT
Write a review

Install

Works with Claude Code, Claude apps, Codex, Cursor, Gemini CLI, GitHub Copilot, VS Code, OpenCode, Goose, Windsurf. Read the repository before you give any tool access to your data.

npx agentmarket install skill/medboughrara-pcb-thermal-analysis

Asks which of your tools to add it to (Claude Code, Codex, Cursor, VS Code, Windsurf, Gemini CLI, Claude Desktop) and shows the change first. See https://agentmart.dev/cli.

Get the weekly diff

The weekly diff: one email a week with new agent tools, notable updates and grade changes, plus security alerts for tools you follow. Double opt-in, one-click unsubscribe.

We use your email only for this newsletter. Privacy

About

Guidelines and calculations for high-current copper trace power loss and regulator thermal dissipation.

No reviews yet. Installed it? Reviews come from verified installers only. How reviews work

Permissions

What this skill can do and what it asks for, from its SKILL.md. Checked Oct 25, 2026.

Tools
No tools found
Secrets
None asked for
Install scripts
None found

Network hosts it talks to 1

  • codeload.github.com · found in install command

Files it touches

  • ~/.claude/skills/pcb-thermal-analysis

What's inside

Skill name
pcb-thermal-analysis
Description
Guidelines and calculations for high-current copper trace power loss and regulator thermal dissipation.
License
MIT
Instructions
16 lines in SKILL.md · view on GitHub

Files (1)

  • SKILL.md

SKILL.md (first lines)

# PCB Thermal Analysis Playbook

When analyzing PCB thermal loss or linear regulator power dissipation for PCB hardware:

1. **Calculate IPC-2221 Current Density**:
   - Use `calculate_thermal_loss` tool to verify trace width in mils against motor current in Amps.
   - Target maximum trace temperature rise: **+10°C**.

2. **Evaluate Linear Regulators**:
   - Check input/output voltage differential ($V_{in} - V_{out}$).
   - Ensure junction temperature $T_j = T_a + (P_d \cdot R_{\theta JA})$ remains below **85°C** for long-term reliability (max silicon limit 125°C).

3. **Copper Thermal Vias**:
   - Recommend a 3x3 array of 0.3mm thermal vias under SOT-223 / TO-252 exposed GND pads to transfer heat to internal GND planes.

From medboughrara/Jarvis-Copilot, MIT.

More from medboughrara/Jarvis-Copilot

Signals

Stars
0
Forks
0
Open issues
0
Last commit (this folder)
Aug 5, 2026 (2 months ago)

From GitHub (fetched Oct 24, 2026).

Details

License
MIT
First seen
Oct 24, 2026
Last checked
Oct 24, 2026

More from medboughrara

Cite this page

pcb-thermal-analysis skill. Agent Mart. https://agentmart.dev/skills/medboughrara-pcb-thermal-analysis (last updated 2026-10-24)